Fabrication, microstructure, and thermal conductivity of multilayered Cu mesh/AZ31 Mg foil composites
In this study, multilayered Cu mesh/AZ31 Mg foil composites were designed and fabricated by diffusion bonding in a closed graphite mold at 400–445 °C. The effects of temperature on the microstructure of the joints formed and the thermal conductivity of the composite was evaluated. The mechanism responsible for the observed improvement in thermal conductivity was analyzed. After diffusion bonding,
