Development of All Dry Nanoimprint Lift-Off Process for Growth of Nanowires
In this project, nanoimprint lithography has been applied to define gold particles on the surface of an InP wafer. For achieving this aim, a dry etching process has been developed to create resist undercut for the lift-off. In order to prepare the required undercuts, RIE parameters were optimized and desired undercuts were made at etch times of 80 s to 120 s. Also, to obtain anisotropy and high et
