Finite element analysis of transient ballistic-diffusive phonon heat transport in two-dimensional domains
While sub-continuum heat conduction becomes more important as the size of micro/nanodevices keeps shrinking under the mean free path of heat carriers, its computation still remains challenging to the general engineering community due to the lack of easily accessible numerical simulation tools. To address this challenge, this article reports the finite element analysis (FEA) of transient ballistic-